Basic Electronics Engineering - Electronic Engineering (MCQ) questions & answers for Q. 14266

Q.  The bonding cement used in the fabrication process of strain gauge should possess _________
- Published on 21 Oct 15

a. high insulation resistance with better strain transmissibility
b. low insulation resistance with better strain transmissibility
c. low insulation resistance with better stress transmissibility
d. high insulation resistance with better stress transmissibility

ANSWER: high insulation resistance with better strain transmissibility

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