Elex Product Design Test Questions - Set 2

1)   Which among the design characteristics of MUX specifies that the two channels can never be connected instantaneously?

a. Transfer error
b. Crosstalk
c. Throughput rate
d. Break before make switching
Answer  Explanation  Related Ques

ANSWER: Break before make switching

Explanation:
No explanation is available for this question!


2)   The requisite amount of time for output in order to track an input within the specific error band after delivering the sample command while designing sample and hold circuitry is known as ___________

a. Aperture time
b. Hold mode settling time
c. Acquisition time
d. Sampling time
Answer  Explanation  Related Ques

ANSWER: Acquisition time

Explanation:
No explanation is available for this question!


3)   Which type of voltage regulator exhibits an excessive power dissipation in a series pass transistor?

a. Linear
b. Switching
c. Both a and b
d. None of the above
Answer  Explanation  Related Ques

ANSWER: Linear

Explanation:
No explanation is available for this question!


4)   The method used for screening of products along with the design evaluation in order to catch early-term latent defects is renowned as Environmental Stress Screening (ESS) or __________

a. Burn-in testing
b. Burn-out testing
c. Burn-above testing
d. Burn-below testing
Answer  Explanation  Related Ques

ANSWER: Burn-in testing

Explanation:
No explanation is available for this question!


5)   Bump is basically the force experienced by a product since it is bounded on a _______

a. Soft surface
b. Hard surface
c. Hot surface
d. Cold surface
Answer  Explanation  Related Ques

ANSWER: Hard surface

Explanation:
No explanation is available for this question!


6)   Which type of test chamber style in an environmental testing has a provision of access through door so as to reach and handle the contents of chamber?

a. Benchtop
b. Floor-mount
c. Reach-In
d. Laboratory-Scale
Answer  Explanation  Related Ques

ANSWER: Reach-In

Explanation:
No explanation is available for this question!


7)   Which actions must be undertaken over the souring consequences of finishes in the vibration type of enclosure testing?

a. Provision of proper heat treatment to the components
b. Use of lock washers
c. Use of special relays
d. Use of special greases in assembly
Answer  Explanation  Related Ques

ANSWER: Use of special greases in assembly

Explanation:
No explanation is available for this question!


8)   In mechanical shock type of an enclosure testing, the usability of materials with high tensile strength is necessary for overcoming the effect of  __________

a. Deformation
b. Fatigue
c. Ripping of components
d. Insulation degradation
Answer  Explanation  Related Ques

ANSWER: Ripping of components

Explanation:
No explanation is available for this question!


9)   NEMA-4X standard excogitates its applications in _______

a. Indoor & Outdoor areas
b. Hazardous area
c. At site
d. At site but non-hazardous area
Answer  Explanation  Related Ques

ANSWER: Hazardous area

Explanation:
No explanation is available for this question!


10)   Which IEC standard plays an important role in measuring an ability of an equipment in order to tolerate the transients associated with switching and lightning?

a. ESD
b. Radiated EMI
c. Fast Transients
d. Transients-surges
Answer  Explanation  Related Ques

ANSWER: Transients-surges

Explanation:
No explanation is available for this question!


11)   How does the burden of legal liabilities get reduced in the process of documentation?

a. By failure modes
b. By operational limits
c. By warning of hazardous operations
d. All of the above
Answer  Explanation  Related Ques

ANSWER: All of the above

Explanation:
No explanation is available for this question!


12)   Which type of maintenance is associated or concerned with an elimination of failures during the operational level of an equipment?

a. Preventive
b. Predictive
c. Breakdown
d. Capital
Answer  Explanation  Related Ques

ANSWER: Breakdown

Explanation:
No explanation is available for this question!


13)   On which factors does the down-time of an equipment at the maintainability phase, depend?

a. Design
b. Installation
c. Both a and b
d. None of the above
Answer  Explanation  Related Ques

ANSWER: Both a and b

Explanation:
No explanation is available for this question!


14)   What would happen, if an equipment possesses reliability and maintainability to the maximum extent in accordance to MTTR?

a. Failure rate is higher & downtime is longer
b. Failure rate is lower & downtime is longer
c. Failure rate is higher & downtime is shorter
d. Failure rate is lower & downtime is shorter
Answer  Explanation  Related Ques

ANSWER: Failure rate is lower & downtime is shorter

Explanation:
No explanation is available for this question!


15)   What would be the composite failure rate of a system comprising one VLSI microprocessor with 6 SSI ICs  and 10 resistors corresponding to the data given below?

Assume a single board system
PCB 2000 FIT
SSIC 70 FIT
R  20 FIT
VLSI microprocessor 600 FIT


a. 1250 FIT
b. 2400 FIT
c. 3220 FIT
d. 4520 FIT
Answer  Explanation  Related Ques

ANSWER: 3220 FIT

Explanation:
No explanation is available for this question!


16)   Which type of availability deals with the probability of system operation and functioning at the requisite level in an ideal environment without any consideration of maintenance?

a. Inherent availability
b. Achieved availability
c. Operational availability
d. None of the above
Answer  Explanation  Related Ques

ANSWER: Inherent availability

Explanation:
No explanation is available for this question!


17)   Which op-amp device serves to be an ideal application for differential as well as instrumentation amplifier?

a. μA748
b. LM318
c. AD OP-27
d. None of the above
Answer  Explanation  Related Ques

ANSWER: AD OP-27

Explanation:
No explanation is available for this question!


18)   Which methods are adopted to improve CMRR in three op-amp instrumentational amplifier?

a. By introducing guards, terminals & references
b. By Bootstrapped Power Supply
c. Both a and b
d. None of the above
Answer  Explanation  Related Ques

ANSWER: Both a and b

Explanation:
No explanation is available for this question!


19)   Which factor/s affect/s the signal integrity of an instrument?

a. Bends
b. Crosstalk
c. Stub length
d. All of the above
Answer  Explanation  Related Ques

ANSWER: All of the above

Explanation:
No explanation is available for this question!


20)   Which among the following oscilloscopes exhibits a serial processing architecture?

a. DPO
b. DSO
c. MSO
d. All of the above
Answer  Explanation  Related Ques

ANSWER: DSO

Explanation:
No explanation is available for this question!


21)   Which among the following elements of EMC model contribute/s in generating the interference in signal integrity?

a. Energy source
b. Receptor
c. Coupling path between source & receptor
d. All of the above
Answer  Explanation  Related Ques

ANSWER: All of the above

Explanation:
No explanation is available for this question!


22)   Which pin assists in transferring the contents of counter into latches under external control in ICM 7217A LED display?

a. EQUAL
b. UP/ DOWN
c. RESET
d. STORE
Answer  Explanation  Related Ques

ANSWER: STORE

Explanation:
No explanation is available for this question!


23)   What does CARRY/BORROW generated output indicates in 7217A LED display?

a. Count is zero
b. Count is equal to the value contained in the register
c. Consent to perform direct cascading of counters
d. All of the above
Answer  Explanation  Related Ques

ANSWER: Consent to perform direct cascading of counters

Explanation:
No explanation is available for this question!


24)   Why is the count input of 7217A LED display provided with a Schmitt Trigger Circuit?

a. To prevent multiple triggering with slowly changing input
b. To permit its operation in noisy environment
c. Both a and b
d. None of the above
Answer  Explanation  Related Ques

ANSWER: Both a and b

Explanation:
No explanation is available for this question!


25)   Which among the following forms a basis of decision construct in the structured programming?

a. SEQUENCE Construct
b. DERIVED Construct
c. REPEAT Construct
d. CHOICE Construct
Answer  Explanation  Related Ques

ANSWER: CHOICE Construct

Explanation:
No explanation is available for this question!


26)   Which type of Fuzzy front-end element deals with an evolutionary and iterative mechanism progressing from birth to maturation of opportunity into a tangible idea?

a. Opportunity Identification
b. Opportunity Analysis
c. Idea Genesis
d. Idea Selection
Answer  Explanation  Related Ques

ANSWER: Idea Genesis

Explanation:
No explanation is available for this question!


27)   By which name does the Fuzzy front-end literary renowned as?

a. Phase 0
b. Stage 0
c. Pre-Project Activities
d. All of the above
Answer  Explanation  Related Ques

ANSWER: All of the above

Explanation:
No explanation is available for this question!


28)   Decompiler is basically a program which performs translation  ________

a. From low level to high level language
b. From high level to low level language
c. Between low level languages
d. Between high level languages
Answer  Explanation  Related Ques

ANSWER: From low level to high level language

Explanation:
No explanation is available for this question!


29)   Which among the following assists in obtaining the desired value of wave impedance in reflection phase while designing digital PCBs?

A. Width of signal lines
B. Distance between signal line and ground line
C. Signal Delays
D. Double Pulsing


a. A & B
b. B & C
c. C & D
d. A, B, C, D
Answer  Explanation  Related Ques

ANSWER: A & B

Explanation:
No explanation is available for this question!


30)   Which among the below specified condition is precise in the crosstalk verification mechanism using logic flow in opposite direction with the limit of avoiding dangerous interference in digital PCB designing?

a. Zeven > Zodd
b. Zodd ≥ 0.5 Zeven
c. Zodd ≥ 0.8 Zeven
d. Zodd = Zeven
Answer  Explanation  Related Ques

ANSWER: Zodd ≥ 0.8 Zeven

Explanation:
No explanation is available for this question!


31)   Which among the below mentioned assertions is not a way of cross-talk reduction while designing digital PCBs?

a. Decrease in the distance between conductors
b. Shielding of clock lines with guard strips
c. Reduction in the loop area of circuits
d. Avoid running of parallel traces for longer distances especially for asynchronous signals
Answer  Explanation  Related Ques

ANSWER: Decrease in the distance between conductors

Explanation:
No explanation is available for this question!


32)   Which among the below stated devices/equipments are preferred for elimination of  ground and supply line noise especially in TTL/CMOS / ECL PCB designing?

a. Coupling capacitor
b. Decoupling capacitor
c. Snubber circuits
d. All of the above
Answer  Explanation  Related Ques

ANSWER: Decoupling capacitor

Explanation:
No explanation is available for this question!


33)   Which among the below specified assertions is not a grounding consideration associated with ADC as well as DAC?

a. Analog side to analog ground
b. Digital side to digital ground
c. Use of separate power supply and connection of their ground leads to single point reference
d. Reduction of inductive loop area between power and return traces
Answer  Explanation  Related Ques

ANSWER: Reduction of inductive loop area between power and return traces

Explanation:
No explanation is available for this question!


34)   Which phenomenon is not reduced by the circuit paths of lowest impedances especially provided by power and return planes for shielding purposes?

a. Radiation
b. Convection
c. Noise
d. Crosstalk
Answer  Explanation  Related Ques

ANSWER: Convection

Explanation:
No explanation is available for this question!


35)   What is/are the necessity/ies to provide guarding to precision differential amplifiers?

a. To increase leakage resistance
b. To reduce capacitance between signal conductors & ground
c. Both a and b
d. None of the above
Answer  Explanation  Related Ques

ANSWER: Both a and b

Explanation:
No explanation is available for this question!


36)   Which among the below specified SINAD measurements indicates an ability of receiver for the demodulation of desired signal in the presence of strong interfering signal at the neighboring RF channel?

a. Reference Sensitivity
b. Adjacent Channel Rejection
c. Receiver Intermodulation
d. None of the above
Answer  Explanation  Related Ques

ANSWER: Adjacent Channel Rejection

Explanation:
No explanation is available for this question!


37)   What should be the value of SINAD, if noise power, distortion power and the signal power are 11 dB, 10 dB and 13 dB respectively?

a. 99 dB
b. 106 dB
c. 120 dB
d. 150 dB
Answer  Explanation  Related Ques

ANSWER: 106 dB

Explanation:
No explanation is available for this question!


38)   Which among the below specified parameters is not associated with the designing of an optimal symbol set?

a. Channel bandwidth
b. Noise characteristics of channel and receiver
c. Desired Information Rate
d. Transmitter complexity
Answer  Explanation  Related Ques

ANSWER: Transmitter complexity

Explanation:
No explanation is available for this question!


39)   Which parameters are controlled by parametric or multi-band variable equalizers?

a. Amplitude
b. Center frequency
c. Bandwidth
d. All of the above
Answer  Explanation  Related Ques

ANSWER: All of the above

Explanation:
No explanation is available for this question!


40)   Radio Fade Margin deals with the expression associated with the availability of margin between __________

a. Strength level of transmitted signal & receiver sensitivity of radio
b. Strength level of received signal & receiver sensitivity of radio
c. Strength level of transmitted signal & transmitter sensitivity
d. Strength level of transmitted signal & received signal
Answer  Explanation  Related Ques

ANSWER: Strength level of received signal & receiver sensitivity of radio

Explanation:
No explanation is available for this question!